Electroless Deposition of Tin Using Contact with Zinc Powder in the Bath
نویسندگان
چکیده
منابع مشابه
Room temperature synthesis of indium tin oxide nanotubes with high precision wall thickness by electroless deposition
Conductive nanotubes consisting of indium tin oxide (ITO) were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs) with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thic...
متن کاملElectroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
متن کاملA Study on Electroless Deposition of Nickel on Nano Alumina Powder Under Different Sensitization Conditions
This paper deals with the preparation and characterization of Nickel-coated Alumina ceramic particles by Electroless Plating Technique. Nanosized α-Al2O3 powders of about 50nm in diameter are used for plating. The bath for Electroless Nickel Plating is prepared with NiCl2.6H2O, C6H5NaO7.H2O, NH4Cl and NaH2PO2.H2O. A bath temperature of 85°C, pH value of 8 and stirring time of 20 min is consider...
متن کاملIncomplete elimination of precursor ligands during atomic layer deposition of zinc-oxide, tin-oxide, and zinc-tin-oxide.
For atomic layer deposition (ALD) of doped, ternary, and quaternary materials achieved by combining multiple binary ALD processes, it is often difficult to correlate the material properties and growth characteristics with the process parameters due to a limited understanding of the underlying surface chemistry. In this work, in situ Fourier transform infrared (FTIR) spectroscopy was employed du...
متن کاملFormation of Au Microbump Arrays for Flip-Chip Bonding Using Electroless Au Deposition from a Non-Cyanide Plating Bath
The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2014
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.65.453